Schemes, Disassembly, Repair and Review Samsung Galaxy Note 7

To begin with, we recall that the Galaxy Note7 model for the first time in the series tried on a protected design - compliance with the requirements of the standard IP68 indicates that the device is dust-proof and remains operational after a half-hour stay underwater at a depth of up to one and a half meters. As demonstrated by the disassembly, this was achieved by protecting the "problem" places: a 3.5 mm headphone jack received a rubber gasket, the speaker is covered with several layers of special material, and the slot for the digital pen S Pen is generously treated with a huge amount of glue. By the way, in the case of Samsung Galaxy Note7 insert a pen into the slot with the wrong end will not work, that you can only greet.


Directly on the motherboard you can see a "sandwich" from Qualcomm Snapdragon 820 and LPDDR4 chipsets Samsung K3RG2G20CMMGCJ 4 GB, flash memory Samsung KLUCG4J1CB-B0B1 64 GB, compliant with the UFS 2.0 specification, Qualcomm WCD9335 audio codec, Avago AFEM-9040 multi- band radio module, NFC controller NXP 67T05, module Murata FAJ15, and also radio modules Qorvo QM78064 TQF6260 and QM63001A.

On the back side is the Wi-Fi adapter Samsung 3420S7 G707A3, the touch input controller Wacom W9018, the power management chips Qualcomm PM8996 and PM8004, the Qualcomm WTR4905 and WTR3925 transceivers, the IDT P9221 wireless power supply + MPB02 603PD9 1625ELn + MAX77830 power supply chips.

It is worth noting an unusual cable, through which the battery is connected to the motherboard. The battery itself is characterized by a voltage of 3.85 V and a capacity of 13.48 W ∙ h (3500 mAh). This is significantly larger than the iPhone 6s Plus (10.45 W ∙ h), but slightly smaller compared to the Galaxy S7 Edge (13.86 W ∙ h).

During disassembly, a small heat pipe was discovered.


As a result, the smartphone earned four points out of ten possible (the maximum score of 10 corresponds to the most easily repairable devices). The pluses included many modular components and an improved cable routing scheme (it was possible to replace the chip with a charging connector without removing the screen). As for the minuses, they include the impossibility of replacing the battery without dismantling the motherboard, as well as the huge amount of strong glue on the rear panel, which significantly complicates the replacement of the battery, the need to dismantle the glass on the panels to access the inside of the device. In addition, it is noted that it is impossible to replace the front glass without damaging the panel, and using glass on both sides of the case makes the device more fragile.